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Damage and strain in pseudomorphic vs relaxed GexSi1?x layers on Si(100) generated by Si ion irradiation
Authors:D Y C Lie  A Vantomme  F Eisen  T Vreeland  M -A Nicolet  T K Carns  K L Wang  B Holländer
Affiliation:(1) California Institute of Technology, 91125 Pasadena, CA;(2) Department of Electrical Engineering, University of California, 90024 Los Angeles, CA;(3) Institiute of Thin Film and Ion Technology, Jülich, Germany;(4) National Fund for Scientific Research, Belgium
Abstract:We compare both the strain and damage that 100 keV Si irradiation at room temperature introduces in pseudomorphic and relaxed GexSi1−x films grown on Si(100) substrates. The ion range is such that the Si/GexSi1−x interface is not significantly damaged. The amount of damage produced in pseudomorphic and relaxed GexSi1−x layers of similar x for irradiation doses up to 2.5 × 1014 Si/cm2 is the same, which proves that a pre-existing uniform strain does not noticeably affect the irradiation-induced damage. However, the irradiation-induced strain does depend on the pre-existing strain of the samples. Possible interpretations are discussed. On leave from Inst. voor Kern en Stralingsfysika, Catholic University of Leuven, Belgium.
Keywords:GeSi  irradiation damage  Si ion irradiation
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