| 直接键合硅片的亲水处理及其表征 |
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| 引用本文： | 何进,陈星弼,杨传仁,王新.直接键合硅片的亲水处理及其表征[J].半导体技术,1999,24(5):23-25,29. |
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| 作者姓名： | 何进 陈星弼 杨传仁 王新 |
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| 作者单位： | 电子科技大学微电子所,成都,610054 |
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| 摘 要： | 硅片直接键合技术的关键在于硅片表面的亲水处理，本文分析了亲水处理之微观机理，从界（表）面物理化学角度讨论了接触角对硅片表面亲水性的表征及其准确测量方法，并测量了常用清洗液的接触角大小。
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| 关 键 词： | 硅片直接键合 亲水处理 接触角 |
Characterization of Silicon Surface Hydrophilicity Treatment |
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| He Jin,Chen Xingbi,Yang Chuanren,Wang Xin.Characterization of Silicon Surface Hydrophilicity Treatment[J].Semiconductor Technology,1999,24(5):23-25,29. |
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| Authors: | He Jin Chen Xingbi Yang Chuanren Wang Xin |
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| Abstract: | Successful Silicon to silicon direct bonding(SDB)mainly depend on the hydrophilicity treatment of silicon surface.Micro mechanism of hydrophilicity has been analyzed in the paper for the first time.From the point of physical chemistry of surface,the hydrophilicity level of common surface treatment can be characterized by the contact angle of a drop of water on the silicon surface.An indirect method to determine the contact angle based on suspensory principle is developed. |
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| Keywords: | SDB Hydrophilicity treatment Contact angle |
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