MEMS加工技术及其工艺设备

微电子机械和纳米技术的研究覆盖了亚微米到纳米尺寸的特征范围,它主要依靠光刻和图形转换设备和工艺获得,但又不仅限于半导体加工范畴。光学光刻设备、感应耦合等离子体刻蚀,金属的溅射涂覆,金属的等离子体增强CVD、介质隔离、掺杂注入、粒子柬微写设备和X射线源可以看作MEMS和纳米技术的机械加工手段,其各有独具的优势限制。现正被用于定制的MEMS器件到真空微电子器件和新颖的纳米工具的研究与开发应用。抗蚀剂喷涂技术为复杂形貌的MEMS器件光刻提供了高均匀性作图的厚胶基础。对于MEMS技术进入产业化的主要技术瓶颈-MEMS封装技术研究与开发已成为当今世界各国关注的热点。同时,对于MEMS器件的测试技术的研究,目前在国际上也引起了高度的重视。

MEMS Micromachining Technology and Tools

Research into Microelectromechanics(MEMS) and Nanotechnology covers the range of feature dimensions from submillimetre to nanometer scales. It relies upon tools and processes for lithography and pattern transfer drawn largely but not exclusively from the silicon semiconductor industry. Optical lithography systems, ICP, Sputter coating of metals, Plasma enhanced chemical vapour deposition of metals and dielectric insulators and ion implantation doping, particle beam nanowriter tools and X-ray sources may be regarded as the 'machine tools'for MEMS and Nanotechnology, each with their u-nique advantages and limitations. They are being exploited for R&D applications ranging from customized MEMS to vacuum microelectronics and novel nanotools. The technique bottleneck that MEMS technology come into industrialize of MEMS packaging technical R&D is being the highlights of the whole world .Whilst ,the research of MEMS testing technique is also caused the height attach importance to the global area.