Wetting of AgCu-Ti filler on porous Si3N4 ceramic and brazing of the ceramic to TiAl alloy |
| |
| Authors: | Xiaoguo Song Yixuan Zhao Shengpeng Hu Jian Cao Wei Fu Jicai Feng |
| |
| Affiliation: | 1. State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China;2. School of Materials Science and Engineering, Harbin Institute of Technology at Weihai, Weihai 264209, China |
| |
| Abstract: | The effect of Ti content on the wettability of AgCu-Ti filler on porous Si3N4 ceramic was studied by the sessile drop method. AgCu-2 wt% Ti filler alloy showed a minimum contact angle of 14.6° on porous Si3N4 ceramic during the isothermal wetting process. The mechanism of AgCu-Ti filler wetting on porous Si3N4 ceramic is clarified in this paper. Porous Si3N4 ceramic was brazed to TiAl alloy using AgCu-xTi (x = 0, 2 wt%, 4 wt%, 6 wt%, 8 wt%) filler alloy at 880 °C for 10 min. The effect of Ti content on the interfacial microstructure and mechanical properties of porous-Si3N4/AgCu-xTi/TiAl joints are studied. The typical interfacial microstructure of p-Si3N4/AgCu-Ti/TiAl joint is p-Si3N4/penetration layer (Ag(s,s)+Si3N4+TiN+Ti5Si3)/Ag(s,s)+Cu(s,s)+TiCu/AlCu2Ti/TiAl. The maximum shearing strength of the brazed joint was 14.17 MPa and fracture that occurred during the shearing test propagated in the porous Si3N4 ceramic substrate for the formation of the penetration layer. |
| |
| Keywords: | Wettability TiAl Alloy Brazing Interfacial microstructure |
| 本文献已被 ScienceDirect 等数据库收录！ |
|
