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A numerica1 study of fluid flow and heat transfer in different microchannel heat sinks for electronic chip cooling |
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| Authors: | Xu Shanglong Hu Guangxin Qin Jie Yang Yue |
| Affiliation: | 1.Department of Mechatronics Engineering, University of Electronic Science and Technology of China, Chengdu, China ;2.School of Mechanical & Vehicle Engineering, Beijing Institute of Technology, Beijing, China ; |
| Abstract: | Four different microchannel heat sinks are designed to study the effects of structures in microchannel heat sinks for electronic chips cooling. Based on the theoretic analysis and numerical computation of flow and heat exchange characteristics, the electronic chip’s temperature and flow rate distributions are obtained. The correspondence between flow pressure drop and chip’s temperature in the four microchannel heat sinks is also studied and analyzed. Numerically analyzed results indicate that the topological structure in microchannel heat sink has a significant influence on electronic chips cooling. This study shows various thermal properties in the four microchannel heat sinks. |
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