| 通孔再流焊接技术 |
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| 引用本文： | 王修利,史建卫,钱乙余,柴勇. 通孔再流焊接技术[J]. 电子工业专用设备, 2007, 36(5): 34-39 |
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| 作者姓名： | 王修利 史建卫 钱乙余 柴勇 |
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| 作者单位： | 哈尔滨工业大学现代焊接生产技术国家重点试验室,黑龙江,哈尔滨,150001;日东电子科技(深圳)有限公司,广东,深圳,518103 |
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| 摘 要： | 通孔再流焊技术是将通孔元件结合到表面组装工艺的一种工艺方法,虽然存在不足之处,但是通过适当的工艺设计和工艺过程控制,通孔再流焊焊点质量与可靠性是可以与传统替代工艺相媲美的.
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| 关 键 词： | 强制热风再流焊 通孔再流焊 钎料填充率 剥离 批量挤压式印刷工艺 |
| 文章编号： | 1004-4507（2007）05-0034-06 |
| 修稿时间： | 2007-04-17 |
Through Hole Reflow Soldering Technology |
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| WANG Xiu-li,SHI Jian-wei,QIAN Yi-yu,CHAI Yong. Through Hole Reflow Soldering Technology[J]. Equipment for Electronic Products Marufacturing, 2007, 36(5): 34-39 |
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| Authors: | WANG Xiu-li SHI Jian-wei QIAN Yi-yu CHAI Yong |
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| Affiliation: | 1 .Harbin Institute of Technology, Harbin, 150001, China; 2.Sun East Electronic Technology Company Lt.d, Shenzhen, 518103 China |
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| Abstract: | Through hole reflow soldering is a way that combine through hole components with SMT. Although there are many disadvantages, solder joint quality and reliability of THR equal to traditional process instead by controlling design and process properly. |
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| Keywords: | Forced Hot Air Reflow Soldering Through Hole Reflow (THR) or Pin In Paste (PIP) Filling Ratio of Solder Fillet Lifting PumpPrinting Technology |
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