| 晶圆针测技术的异常问题分析与研究 |
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| 引用本文： | 罗士凯,汪辉.晶圆针测技术的异常问题分析与研究[J].电子与封装,2007,7(9):1-3. |
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| 作者姓名： | 罗士凯 汪辉 |
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| 作者单位： | 上海交通大学微电子学院,上海,200030;中芯国际集成电路制造(上海)有限公司,上海,201206;上海交通大学微电子学院,上海,200030 |
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| 摘 要： | 在晶圆探针测试当中,常会由于测试环境或是针测机台参数的改变,使得针痕不正常偏移并打出开窗区,造成测试时的误宰,因而造成公司的损失。文章将就晶圆针测中,由于温度变化所造成的不正常针痕偏移进行分析与研究。
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| 关 键 词： | 晶圆针测 误宰 针痕偏移 |
| 文章编号： | 1681-1070（2007）09-0001-03 |
| 修稿时间： | 2007-05-07 |
Analysis and Research Results of Wafer Probing on Abnormal Problem |
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| LUO Shi-kai,WANG Hui.Analysis and Research Results of Wafer Probing on Abnormal Problem[J].Electronics & Packaging,2007,7(9):1-3. |
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| Authors: | LUO Shi-kai WANG Hui |
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| Affiliation: | 1.SJTU Microelectronic College 200030, China; 2. Semiconductor Manufacturing International Corporation 201206, China |
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| Abstract: | In wafer testing process, it will causes abnormal probe mark shift and probe mark out of the pad due to the changing of testing environment or prober parameters. That will cause overkill and then diminish the company profit .So at here, I will share my analysis and research results on abnormal probe mark shift due to temperature change during the wafer testing process. |
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| Keywords: | wafer probing overkill probe mark shift |
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