| 与CMOS-SEED灵巧象素相关的倒装焊工艺 |
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| 引用本文： | 李献杰,曾庆明,蔡克理,敖金平,赵永林,焦智贤,王全树,郭建魁. 与CMOS-SEED灵巧象素相关的倒装焊工艺[J]. 微纳电子技术, 1999, 0(1) |
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| 作者姓名： | 李献杰 曾庆明 蔡克理 敖金平 赵永林 焦智贤 王全树 郭建魁 |
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| 作者单位： | 河北半导体研究所专用集成电路国家级重点实验室 |
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| 摘 要： | 介绍了新型ＣＭＯＳ－ＳＥＥＤ灵巧象素结构原理及相关的倒装焊技术，采用厚光致抗蚀剂作掩模，通过磁控溅射和真空蒸发相结合，解决了与ＣＭＯＳ－ＳＥＥＤ有关的Ｉｎ凸点阵列成型等关键工艺，并用Ｍ８－Ａ型可视对准式倒装焊系统完成了ＣＭＯＳ电路芯片和ＳＥＥＤ阵列芯片的倒装焊。
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| 关 键 词： | 倒装焊 CMOS－SEED 凸点 |
Flip Chip Bond Technique Related to CMOS SEED Smart Pixels |
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| Li Xianjie,Zeng Qingming,Cai Keli,Ao Jinping,Zhao Yonglin,Jiao Zhixian,Wang Quanshu,Guo Jiankui. Flip Chip Bond Technique Related to CMOS SEED Smart Pixels[J]. Micronanoelectronic Technology, 1999, 0(1) |
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| Authors: | Li Xianjie Zeng Qingming Cai Keli Ao Jinping Zhao Yonglin Jiao Zhixian Wang Quanshu Guo Jiankui |
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| Abstract: | The structure of CMOS SEED smart pixels and the related flip chip bond technique were introduced.Using thick photo resist as a mask,indium solder bump array was manufactured through magnetic sputtering and vacuum vaporing method.As a result,the CMOS IC chip and SEED array chip were flip bonded by a M8 A visible align flip chip bonder system. |
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| Keywords: | Flip chip bond CMOS SEED Bump |
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