| BGA焊点在板级跌落实验中的疲劳寿命估计 |
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| 引用本文： | 瞿欣,娄浩焕,陈兆轶,祁波,LEE Taekoo,王家楫. BGA焊点在板级跌落实验中的疲劳寿命估计[J]. 半导体技术, 2006, 31(6): 432-436 |
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| 作者姓名： | 瞿欣 娄浩焕 陈兆轶 祁波 LEE Taekoo 王家楫 |
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| 作者单位： | 复旦大学材料科学系复旦-三星封装可靠性联合实验室,上海,200433;三星半导体中国研发股份有限公司,江苏,苏州,215021 |
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| 基金项目： | 复旦-三星封装可靠性联合研究项目 |
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| 摘 要： | 按照JEDEC标准对板级跌落实验的要求测试了有铅和无铅焊点的球栅阵列封装.用ANSYS软件建立了有限元分析模型,并用ANSYS/LS-DYNA直接求解器计算了典型结点的应力和应变,以及每次跌落时积累在焊点中的平均应变能密度.利用实验和模拟的结果重新计算了Darveaux模型中的常数,将这个模型的应用范围扩展到了跌落环境,并计算了各种条件下焊点的疲劳寿命.
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| 关 键 词： | 疲劳 无铅 跌落测试 有限元分析 焊点 |
| 文章编号： | 1003-353X(2006)06-0432-05 |
| 收稿时间： | 2006-03-30 |
| 修稿时间： | 2006-03-30 |
Fatigue Life Assessment of Solder Joints of BGA Component in Board Level Drop Test |
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| QU Xin,LOU Hao-huan,CHEN Zhao-yi,QI Bo,LEE Taekoo,WANG Jia-ji. Fatigue Life Assessment of Solder Joints of BGA Component in Board Level Drop Test[J]. Semiconductor Technology, 2006, 31(6): 432-436 |
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| Authors: | QU Xin LOU Hao-huan CHEN Zhao-yi QI Bo LEE Taekoo WANG Jia-ji |
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| Abstract: | Leaded and lead-free BGA (ball grid array) components were tested in board level drop test defined in the JEDEC (Joint Electron Device Engineering Council) standard. FEA (finite element analysis) models were established using ANSYS. The stress and strain of the typical nodes and the average strain energy density accumulated in solder joints in one cycle were calculated using ANSYS/LS-DYNA explicit solver. The results of experiments and simulations were employed to re- calculate the constants contained in the Darveaux model to extend its application to the drop test, the fatigue life of solder joint under different materials and geometrical conditions through this modified model were calculated. |
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| Keywords: | fatigue lead-free, drop test finite element analysis solder joint |
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