| 无铅过渡时期混合焊点可靠性研究进展 |
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| 引用本文： | 宁叶香,潘开林,李逆,李鹏. 无铅过渡时期混合焊点可靠性研究进展[J]. 电子元件与材料, 2008, 27(10) |
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| 作者姓名： | 宁叶香 潘开林 李逆 李鹏 |
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| 作者单位： | 桂林电子科技大学,机电工程学院,广西,桂林,541004;桂林电子科技大学,机电工程学院,广西,桂林,541004;桂林电子科技大学,机电工程学院,广西,桂林,541004;桂林电子科技大学,机电工程学院,广西,桂林,541004 |
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| 摘 要： | 在电子产品向无铅化过渡时期,存在前向兼容和后向兼容混合焊点的可靠性问题,对相关的理论和实验研究进行了综述。重点介绍了后向兼容组装中再流温度曲线的设置、焊点合金成分的计算及液相线温度的估算。简要介绍了前向兼容焊点的可靠性,认为一般情况下其可靠性可被接受。
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| 关 键 词： | 电子技术 混合焊点 综述 前向兼容 后向兼容 可靠性 |
Research progress of mixed solder joint reliability in lead-free transition |
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| NING Ye-xiang,PAN Kai-lin,LI Ni,LI Peng. Research progress of mixed solder joint reliability in lead-free transition[J]. Electronic Components & Materials, 2008, 27(10) |
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| Authors: | NING Ye-xiang PAN Kai-lin LI Ni LI Peng |
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| Affiliation: | NING Ye-xiang,PAN Kai-lin,LI Ni,LI Peng (School of Mechanical & Electronical Engineering,Guilin University of Electronic Technology,Guilin 541004,Guangxi Zhuangzu Zizhiqu,China) |
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| Abstract: | There are the reliability problems of forward and backward compatible mixed solder joints in electronic productead-free transition. The correlative theory and experimental research in the field were reviewed. Mainly described the reflow temperature curve setting up, the solder joint alloy componental calculation and estimation of liquid phase line temperature for backward compatibility assembly. In the meantime, the reliability of forward compatibility solder joint was simply introduced, the reliability may... |
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| Keywords: | electron technology mixed solder joint review forward compatibility backward compatibility reliability |
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