薄膜溅射沉积过程中的原子喷丸效应

原子喷丸效应是薄膜溅射沉积过程中的普遍现象，是指反弹工作气体原子和溅射原子构成的荷能粒子流对生长膜面的轰击作用。这些荷能粒子在向基片输运的过程中受到工作气体原子的散射。原子喷丸效应与靶材和工作气体的原子质量比以及工作气体压强密切相关。以平面磁控溅射Co－Cr，Ni-Fe和Gd－Fe等二元合金薄膜为对象，研究其内应力与Ar工作气体压强的关系，并探讨原子喷丸效应对应力的影响。在靶材原子质量较大并且工作气体压强较低的情形下，可导致薄膜中呈压应力。

ATOMIC PEENING EFFECT IN FILM SPUTTERING PROCESS

Atomic peening effect is a general phenomenon in film sputtering process,which indicates the bombarding effect on the growing film surface by energetic particle-flux consisting of rebounded working gas atoms and sputtered atoms. The energetic particles are scattered by working gas atoms during the transfer form target to substrate. Atomic peening effect is closely related to the target-to-working gas atomic mass ratio and working gas pressure. In this paper,with respect to Co-Cr,Ni-Fe and Gd-Fe binary alloy thin films deposited by planar magnetron sputtering, the dependence of internal stress on Ar working gas pressure is studied, and the contribution of atomic peening effect to the stress is discussed. When the atomic mass of target material is 1arger,and the working gas pressure is 1ow enough,a compressive stress in thin films can be produced.