| 高性能覆铜板用热固性树脂 |
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| 引用本文： | 田勇,程江,皮丕辉,文秀芳,杨卓如.高性能覆铜板用热固性树脂[J].热固性树脂,2004,19(6):24-27. |
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| 作者姓名： | 田勇 程江 皮丕辉 文秀芳 杨卓如 |
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| 作者单位： | 华南理工大学化学工程学院,广东,广州,510640 |
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| 摘 要： | 介绍了高频高性能覆铜板对基材的性能要求,详细讨论了聚苯醚树脂、氰酸酯树脂及聚酰亚胺树脂的特性,并简要介绍了各种树脂基覆铜板的应用情况。通过分析认为:烯丙基化聚苯醚树脂(A PPE)是高频应用的理想材料,为高频高性能电路基板材料首选的树脂基体。
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| 关 键 词： | 聚苯醚 氰酸酯 聚酰亚胺 覆铜板 |
| 文章编号： | 1002-7432(2004)06-0024-04 |
| 修稿时间： | 2004年5月19日 |
THERMOSETTING RESIN FOR HIGH PERFORMANCE COPPER CLAD LAMINATE |
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| TIAN Yong,CHENG Jiang,PI Pi-hui,WEN Xiu-fang,YANG Zhuo-ru.THERMOSETTING RESIN FOR HIGH PERFORMANCE COPPER CLAD LAMINATE[J].Thermosetting Resin,2004,19(6):24-27. |
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| Authors: | TIAN Yong CHENG Jiang PI Pi-hui WEN Xiu-fang YANG Zhuo-ru |
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| Abstract: | The requirement of matrix resin for the high frequency and high performance copper clad laminate was introduced and polyphenylene ether resin,cyanate resin and polyimide resin were also discussed in detail.Furthermore,the applications of these laminate were also briefly mentioned.Analysis showed that allylated polyphenylene ether resin was the ideal and the first choice material for high frequency and high performance copper clad laminate. |
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| Keywords: | polyphenylene ether cyanate polyimide copper clad laminate |
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