Standard and self-sustained magnetron sputtering deposited Cu films investigated by means of AFM and XRD |
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Authors: | A Wiatrowski WM Posadowski G Jó?wiak J Serafińczuk R Szeloch T Gotszalk |
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Affiliation: | Faculty of Microsystem Electronics and Photonics, Wroclaw University of Technology, Janiszewskiego 11/17, 50-370 Wroclaw, Poland |
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Abstract: | The goal of conducted investigations was to study microstructure and surface morphology of copper thin films deposited during standard (with argon) and self-sustained (without argon presence) magnetron sputtering deposition processes. Different types of magnetron source powering were used: direct current (DC), medium frequency (MF), pulsed-DC. The investigated copper films were deposited by means of balanced magnetron sputtering source on Si (1 1 1) substrates. The results of investigations showed that the average size of the copper crystallites of all samples were equal to dozens of nanometre. However, the self-sustained sputtering deposition processes, in comparison to the standard ones, resulted in smoother film surface. |
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