| QFN封装分层失效与湿-热仿真分析 |
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| 引用本文： | 赵亚俊,常昌远,陈海进,高国华. QFN封装分层失效与湿-热仿真分析[J]. 半导体技术, 2010, 35(6): 550-554. DOI: 10.3969/j.issn.1003-353x.2010.06.009 |
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| 作者姓名： | 赵亚俊 常昌远 陈海进 高国华 |
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| 作者单位： | 东南大学,南京,210096;南通富士通微电子股份有限公司,江苏,南通,226006;东南大学,南京,210096;南通大学,江苏,南通,226019;南通富士通微电子股份有限公司,江苏,南通,226006 |
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| 摘 要： | 采用湿度敏感度评价试验及湿-热仿真方法,分析了温湿度对于QFN封装分层失效的影响.通过C-SAM和SEM等观察发现,QFN存在多种分层形式,分层大多发生在封装内部材料的界面上,包括封装塑封材料和芯片之间的界面、塑封材料和框架之间的界面等.此外,在封装断面研磨的SEM图像上发现芯片粘结剂内部有空洞出现.利用有限元数值模拟的方法,对QFN封装的内部湿气扩散、回流过程中的热应力分布等进行了模拟,分析QFN分层失效的形成原因.结果表明,由于塑封器件材料、芯片、框架间CTE失配,器件在高温状态湿气扩散形成高气压条件下易产生分层.最后提出了改善QFN分层失效的措施.
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| 关 键 词： | 方形扁平无引线封装 分层失效 有限元数值模拟 湿扩散与热应力 |
Simulation Analysis of Delamination Failure and Thermal-Moisture for QFN Package |
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| Zhao Yajun,Chang Changyuan,Chen Haijin,Gao Guohua. Simulation Analysis of Delamination Failure and Thermal-Moisture for QFN Package[J]. Semiconductor Technology, 2010, 35(6): 550-554. DOI: 10.3969/j.issn.1003-353x.2010.06.009 |
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| Authors: | Zhao Yajun Chang Changyuan Chen Haijin Gao Guohua |
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| Affiliation: | Zhao Yajun1,3,Chang Changyuan1,Chen Haijin2,Gao Guohua3(1.Southeast University,Nanjing 210096,China,2.Nantong University,Nantong 226019,3.Nantong Fujitsu Microelectronics Co.,Ltd.,Nantong 226006,China) |
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| Abstract: | Moisture sensitivity is used for evaluating the test and the wet-thermal simulation method,the effects of temperature and humidity on the failure of QFN package is analyzed.Several delamination modes are found by temperature humidity test with C-SAM and SEM methods,and most delamination are in the interface between different assembly materials,including the interface between mold compound and die and the other interface between mold compound and leadframe;a few voids are also appeared in the adhesive materi... |
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| Keywords: | QFN package delamination failure FEA numerical simulation moisture diffusion and thermal stress |
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