| 硅片湿法清洗工艺技术及设备发展趋势 |
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| 引用本文： | 曹秀芳,姚立新,祝福生,宋文超.硅片湿法清洗工艺技术及设备发展趋势[J].电子工业专用设备,2011,40(4):9-13,28. |
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| 作者姓名： | 曹秀芳 姚立新 祝福生 宋文超 |
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| 作者单位： | 中国电子科技集团公司第四十五研究所,北京,101601 |
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| 摘 要： | 简要介绍了硅片湿化学清洗工艺技术及清洗设备结构技术,包括一些典型的槽体结构、干燥工艺技术等.并就清洗技术的发展需要,阐述未来清洗设备的发展趋势.
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| 关 键 词： | 硅片 污染物 标准工业湿法清洗 槽式清洗 旋转甩干 单片旋转清洗 |
Wafer Suface Wet Chemistry Rinse Technics And Equipment Making Technology |
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| CAO Xiufang,YAO Lixin,ZHU Fusheng,SONG Wenchao.Wafer Suface Wet Chemistry Rinse Technics And Equipment Making Technology[J].Equipment for Electronic Products Marufacturing,2011,40(4):9-13,28. |
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| Authors: | CAO Xiufang YAO Lixin ZHU Fusheng SONG Wenchao |
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| Affiliation: | CAO Xiufang,YAO Lixin,ZHU Fusheng,SONG Wenchao (The 45th Research Institute of CETC,Beijing 101601,China) |
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| Abstract: | This article introduces wafer surface wet chemistry technics and Rinse equipment making technology,including some typical benches structure,drying technology and so on.This article describe The RCA Rinse equipment development roadmap in times to come. |
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| Keywords: | Wafer Contamination The RCA clean Bench tanks Spin Rinse Dryer Single Wafer Spinning Rinse |
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