| Ag2O焊膏中添加镀银铜粉的低温烧结连接及其性能 |
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| 引用本文： | 赵振宇,母凤文,邹贵生,刘磊,闫久春. Ag2O焊膏中添加镀银铜粉的低温烧结连接及其性能[J]. 焊接学报, 2014, 35(2): 15-18 |
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| 作者姓名： | 赵振宇 母凤文 邹贵生 刘磊 闫久春 |
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| 作者单位： | 1.清华大学机械工程系先进成形制造教育部重点实验室, 北京 100084 |
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| 基金项目： | 国家自然科学基金项目(51375261,51075232);北京市自然科学基金项目(3132020);先进焊接与连接国家重点实验室开放课题研究基金重点项目(AWPT-Z12-04);清华大学自主科研计划项目(2010THZ 02-1) |
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| 摘 要： | 微米尺寸Ag2O焊膏相对于纳米银焊膏成本低廉且在高温电子互连封装行业中有应用前景.为了进一步降低连接成本及提高接头的抗电化学迁移能力,向Ag2O焊膏中加入镀银铜粉制得了新型混合焊膏.文中对比了用原有微米尺寸Ag2O焊膏与加入镀银铜粉后的新型混合焊膏连接所得接头的抗剪强度以及两种焊膏烧结后的抗电化学迁移能力.结果表明,在连接温度为250℃时,用含镀银铜粉的混合Ag2O焊膏连接的接头抗剪强度下降明显,但焊膏烧结后的抗电化学迁移能力获得显著提升,水滴试验结果表明其电迁移短路时间延长了一倍以上.
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| 关 键 词： | 镀银铜粉 氧化银焊膏 电化学迁移 电子封装 |
| 收稿时间： | 2013-01-11 |
Low temperature sintering-bonding and the performance of joints using Ag2O paste with an adding of Ag-coated Cu particles |
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| ZHAO Zhenyu,MU Fengwen,ZOU Guisheng,LIU Lei and YAN Jiuchun. Low temperature sintering-bonding and the performance of joints using Ag2O paste with an adding of Ag-coated Cu particles[J]. Transactions of The China Welding Institution, 2014, 35(2): 15-18 |
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| Authors: | ZHAO Zhenyu MU Fengwen ZOU Guisheng LIU Lei YAN Jiuchun |
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| Affiliation: | 1.Department of Mechanical Engineering, Tsinghua University, Beijing 100084, China2.State Key Laboratory of Advanced Welding & Joining, Harbin Institute of Technology, Harbin 150001, China |
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| Abstract: | The micro-scaled Ag2O paste is cheaper than Ag nanoparticle paste and has a promising application prospect in high temperature electronic packaging industry. In order to further reduce the cost and improve the joint ability of the resistance to electrochemical migration (ECM),the Ag-coated Cu particles were added into the original micro-scaled Ag2O paste to make a new composite paste. In this paper,the shear strength of joints obtained by using the original Ag2O paste and the new Ag2O paste contained Ag-coated Cu particles and the two sintered pastes' ability of resistance to ECM were compared. The results revealed that the average shear strength of joints obtained by using the new Ag2O paste with Ag-coated copper at the typical bonding condition (250℃,5 min,2 MPa) showed an obvious decrease,while the ability of the resistance to ECM got a significant increase due to the addition of Ag-coated Cu particles. |
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| Keywords: | Ag-coated Cu particles Ag2O paste Electrochemical migration (ECM) Electronic packaging |
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