The formation of volume elements for microelectromechanical systems in polyimide by method of reactive ion beam etching |
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Authors: | A. I. Stognij T. I. Orekhovskaya Yu. V. Timoshkov S. V. Koryakin |
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Affiliation: | (1) Institute of Solid State and Semiconductor Physics, National Academy of Sciences of Belarus, Minsk, Belarus |
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Abstract: | The main problem related to the creation of microelectromechanical systems—the formation of an anisotropic profile with vertical side walls and clean flat bottom in a thick resist film—is experimentally solved by optimizing the parameters of the reactive ion beam etching process for polyimide (PI) layers with a thicknesses up to 50 μm. The optimized technique was used to form the volume parts of a microelectromotor structure by etching a PI film with an oxygen ion beam (beam current density j=0.5 mA/cm2; ion extraction energy U=800 V). |
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