基于AFM微加工的单晶硅表层性质的研究

在纳米级材料去除率和极小载荷下 ,利用原子力显微镜 (AFM )对单晶硅进行基于金刚石针尖的微加工 ,并且应用扫描电子显微镜 (SEM )对微加工区域及切屑的元素特征进行分析 ,同时应用能谱仪 (EDS)和X射线光电子能谱仪 (XPS)对加工区域及非加工区域的化学成分组成进行对比分析。通过SEM观察发现无论在微加工区域内部还是在其边缘都不产生微裂纹及断裂破坏。元素分析表明微加工后去除的切屑因为松散且具有很大的自由表面面积所以容易被氧化 ,而加工区域内部的XPS分析结果显示出加工表层有非晶态二氧化硅的产生 ,深度值随加工时垂直载荷的不同在 0 .3～ 0 .4nm之间变化

Study on the AFM-based micro-machined silicon surface

An atomic force microscope was used as a machining tool to conduct micro machining on single crystal silicon surface with a diamond tip at nanometer scale material removal rate and under ultra low machining force. The micro machined region and the removed chip elemental features were analyzed with SEM. Additionally, by using EDS and XPS, the chemical features inside and outside the micro machined region were comparatively analyzed. The results show that there were not micro cracks and fracture damage inside the micro machined region and alongside its edges. Elemental analysis indicated that the removed chips easy to be oxidized due to their loose state and hence the large surface area. The XPS analysis showed that there was oxidized layer generated on the machined surface, with depth value ranges from 0.3～0.4 nm corresponds to the machining normal loads varied.