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2-巯基苯并噻唑对化学镀铜的影响
引用本文:昝灵兴,王晓兰,丁杰,孙宇曦,高琼,路旭斌,王增林.2-巯基苯并噻唑对化学镀铜的影响[J].电镀与涂饰,2012,31(7):20-23.
作者姓名:昝灵兴  王晓兰  丁杰  孙宇曦  高琼  路旭斌  王增林
作者单位:1. 陕西师范大学化学化工学院应用表面与胶体化学教育部重点实验室,陕西西安,710062
2. 陕西教育学院化学与化工系,陕西西安,710061
摘    要:以甲醛为还原剂,研究了2-巯基苯并噻唑(2-MBT)对ABS塑料化学镀铜沉积速率、铜镀层表面形貌、纯度、平整度及晶型的影响.化学镀铜的工艺条件为:CuSO4·5H2O 10g/L,EDTA-2Na30g/L,HCHO3mL/L,PEG-10002mg/L,2-MBT0~2mg/L,温度70℃或40℃,pH 12.5,时...

关 键 词:塑料  化学镀铜  2-巯基苯并噻唑  添加剂  沉积速率

Effect of 2-mercaptobenzothiazole on electroless copper plating
ZAN Ling-xing , WANG Xiao-lan , DING Jie , SUN Yu-xi , GAO Qiong , LU Xu-bin , WANG Zeng-lin.Effect of 2-mercaptobenzothiazole on electroless copper plating[J].Electroplating & Finishing,2012,31(7):20-23.
Authors:ZAN Ling-xing  WANG Xiao-lan  DING Jie  SUN Yu-xi  GAO Qiong  LU Xu-bin  WANG Zeng-lin
Affiliation:Key Laboratory for Applied Surface and Colloid Chemistry of the Ministry of Education, School of Chemistry and Chemical Engineering, Shanxi Normal University, Xi’an 710062, China
Abstract:The effect of 2-mercaptobenzothiazole on deposition rate of electroless copper plating on ABS plastic, as well as the surface morphology, purity, evenness, and crystal type of copper coating was studied using formaldehyde as the reducing agent. The process parameters of electroless copper plating are as follows: CuSO 4 ·5H 2 O 10 g/L, EDTA-2Na 30 g/L, HCHO 3 mL/L, PEG-1000 2 mg/L, 2-MBT 0-2 mg/L, temperature 70℃ or 40℃, pH 12.5, and time 1 h. With the addition of low concentration of 2-MBT to the bath, the mixed potential of electroless copper coating becomes more positive, the deposition rate increases, and the density and evenness of Cu coating improves, while the crystal type of coating slightly changes. The obtained Cu coating has high purity as 2-MBT just plays the part of complexant and accelerant during the electroless copper plating.
Keywords:plastic  electroless copper plating  2-mercapto- benzothiazole  additive  deposition rate
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