| 激光加工中自动旋转校位切割的研究 |
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| 引用本文： | 张文斌,孟宪俊,孟凡辉,杨松涛.激光加工中自动旋转校位切割的研究[J].电子工业专用设备,2012,41(7):9-12. |
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| 作者姓名： | 张文斌 孟宪俊 孟凡辉 杨松涛 |
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| 作者单位： | 中国电子科技集团公司第四十五研究所,北京,101601 |
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| 摘 要： | 针对激光加工设备在Al2O3晶圆切割过程中的效率提高问题以及客户需求,通过图像识别功能,研究并设计实现晶圆的自动旋转校位与自动切割功能,极大地提高了晶圆切割效率。
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| 关 键 词： | 激光加工 旋转校位 自动切割 Al2O3晶片 |
Research of Laser Machining Collate Depend On Turning and Incise Automatically |
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| ZHANG Wenbin,MENG Xianjun,MENG Fanhui,YANG Songtao.Research of Laser Machining Collate Depend On Turning and Incise Automatically[J].Equipment for Electronic Products Marufacturing,2012,41(7):9-12. |
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| Authors: | ZHANG Wenbin MENG Xianjun MENG Fanhui YANG Songtao |
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| Affiliation: | ( The 45th Research Institute of CETC, Beijing 101601, China) |
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| Abstract: | Be aim to the last request of the consumers about improving the efficiency during the laser machining collate and incise on the surface of sapphire wafer, this article discuss and achieve the function which automatically collate and incise the wafer by automatically identify the image. This function has commendably improved the efficiency of dicing the wafer. |
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| Keywords: | Laser machining Collate depend on turning Incise Automatically Al2O3wafer |
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