| 射频等离子清洗系统设计 |
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| 引用本文： | 柳国光,苗俊芳,胡文平,师筱娜.射频等离子清洗系统设计[J].电子工业专用设备,2012,41(7):29-31. |
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| 作者姓名： | 柳国光 苗俊芳 胡文平 师筱娜 |
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| 作者单位： | 中国电子科技集团公司第二研究所,山西太原,030024 |
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| 摘 要： | 等离子清洗具有优越的环境特性和去污能力,但缓慢的清洗速度限制了等离子清洗技术的应用,近期等离子领域的研究及实践表明通过控制等离子体的生成条件和工艺气体可以显著提高等离子清洗的去污速度,从而为扩展等离子技术在工业中的应用提供可能。介绍了等离子清洗的原理和方法,分析了影响等离子清洗效果的因素,并完成了射频等离子清洗系统的设计。
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| 关 键 词： | 等离子清洗 影响因素 射频 |
The Design of RF Plasma Cleaning System |
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| LIU Guoguang,MIAO Junfang,HU Wenping,SHI Xiaona.The Design of RF Plasma Cleaning System[J].Equipment for Electronic Products Marufacturing,2012,41(7):29-31. |
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| Authors: | LIU Guoguang MIAO Junfang HU Wenping SHI Xiaona |
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| Affiliation: | (The 2nd Research Institute of CECT, Taiyuan 030024, china) |
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| Abstract: | plasma cleaning is superior in environmental characteristics and decontamination ability, but the slow cleaning rate of a plasma limits the widespread use of plasma cleaning technology. Recent research and practice in the field of plasma provide the possibility of a ultra-fast plasma cleaning processes by controlling plasma conditions and gas mixtures, that will evaluate several new industrial applications of plasma cleaning. This paper introduces the principle and method of plasma cleaning, analysis the influence factors of plasma cleaning and completes the RF plasma cleaning system design. |
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| Keywords: | Plasma Cleaning Influence factor Radio-Frequency |
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