确好芯片商业化的关键问题

基于老化筛选技术的确好芯片KGD是现行多芯片封装结构中的关键芯片,具有封装成本低、可靠性高、体积小、易封装集成等优点,其应用前景广泛,如多芯片组件、多芯片封装、系统封装、功率系统封装、微系统封装、堆叠封装、混合集成电路等。文章对KGD技术做了分类总结,综述了近几年KGD技术的研发进展,指出KGD进一步发展的商业化关键问题。

Critical Issues for Commercialization of Known Good Die

KGD(Known Good Die)based on ageing screening test technology are important chip in multichip package structure.KGD have advantages including low package cost, high reliability, small size, easy package integration, etc. It has broad applications, such as a multichip module, multichip package, systems in package, power systems in package,micro systems package, package on package,hybrid IC. KGD based on ageing screening test technology are classified and summarized. The research progresses of KGD over the pas...