Transient thermo-mechanical analysis of dynamic curving cracks in functionally graded materials |
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Authors: | Sachin Gupta Sandeep Abotula Vijaya B. Chalivendra Arun Shukla Ravi Chona |
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Affiliation: | (1) University of Rhode Island, Kingston, RI, USA;(2) University of Massachusetts, Dartmouth, MA, USA;(3) Auburn University, Auburn, AL, USA |
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Abstract: | Mixed-mode dynamic crack growth behavior along an arbitrarily smoothly varying path in functionally graded materials (FGMs) under transient thermo-mechanical loading is studied. An asymptotic analysis in conjunction with displacement potentials is used to develop transient thermo-mechanical stress fields around the propagating crack-tip. Asymptotic temperature field equations are derived for exponentially varying thermal properties, and later, these equations are used to derive transient thermo-mechanical stress fields for a curving crack in FGMs. The effect of the transient parameters (loading rate, crack-tip acceleration, and temperature change) and temperature gradient on the maximum principal stress and circumferential stress associated with the propagating crack-tip is discussed. Finally, using the minimum strain energy density criterion, the effect of temperature gradient, crack-tip speeds, and T-stress on crack growth directions is determined and discussed. |
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