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Substrate crystal recovery for homoepitaxial diamond synthesis
Affiliation:1. Fraunhofer USA Inc., Center for Coatings and Laser Applications, East Lansing, MI, USA;2. Michigan State University, Department of Electrical and Computer Engineering, East Lansing, MI, USA;1. Namiki Precision Jewel Co. Ltd., Adachi, Tokyo 123-8511, Japan;2. Kyushu University, Kasuga-shi, Fukuoka 816-8580, Japan;3. Aoyama Gakuin University, Sagamihara 252-5258, Japan;1. Department of Electrical Engineering and Electronics, College of Science and Engineering, Aoyama Gakuin University, Sagamihara 252-5258, Japan;2. Toplas Engineering Co., Ltd., Chofu, Tokyo 182-0006, Japan;1. Center for Composite Materials and Structures, Harbin Institute of Technology, Harbin, PR China;2. Key Laboratory of Micro-systems and Micro-structures Manufacturing, Ministry of Education, Harbin 150080, PR China;3. Institute of Radio Engineering and Electronics RAS, Fryazino 141190, Russia;4. General Physics Institute RAS, 38 Vavilov Str., Moscow 119991, Russia
Abstract:Homoepitaxial chemical vapor deposition (CVD) of diamond requires high quality substrate crystals. This paper describes the process of diamond substrate crystal recovery so that the original substrate can be reused for multiple synthesis processes. A three-stage treatment is applied after homoepitaxial CVD growth. First the original substrate is separated by laser cutting, then the cut surface is mechanically polished, and finally polycrystalline material at the edges of the recovered seed plate is laser trimmed. This recovery process yields reusable diamond substrates that do not differ appreciably from their original state in terms of stresses and impurity concentrations. While the recovery process was demonstrated using HPHT seed substrates the process can also be applied to the as-grown CVD diamond plates. Infrared absorption spectral analysis, surface profilometry, birefringence imaging and Raman spectroscopy are performed after each processing step to monitor crystal quality. The nitrogen concentration in the substrate crystal remains constant throughout CVD and recovery processes. When using HPHT type Ib substrates the detected nitrogen concentration is 110–180 ppm. The nitrogen is mainly incorporated in form of C center defects and no transformation to other forms of defect centers occurs during the CVD process. Birefringence imaging showed a low level of internal stress within the HPHT crystals. No change is observed during CVD growth and recovery processes. It is shown that the polycrystalline rim removal is essential for repeatable CVD deposition on the same seed substrate. Substrate crystal recovery allows growth of up to 20 crystals from one original seed.
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