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Effect of metallic seed layers on the properties of nanocrystalline diamond films
Affiliation:1. Tianjin Key Laboratory of Film Electronic and Communicate Devices, School of Electronics Information Engineering, Tianjin University of Technology, Tianjin 300384, China;2. College of Precision Instrument and Opto-electronics Engineering, Tianjin University, Tianjin 300072, China;3. Chinese Peoples Armed Police Forces Academy, Langfang 065000, China;1. CAS Key Laboratory of Cryogenics, Technical Institute of Physics and Chemistry, Beijing, 100190, China;2. Beijing Key Laboratory of Thermal Science and Technology, Technical Institute of Physics and Chemistry, CAS, Beijing, 100190, China;3. University of Chinese Academy of Sciences, Beijing, 100049, China
Abstract:Three metallic films (Mo, Ti and W) were sputtered on Si substrates and ultrasonically seeded in diamond powder suspension. Nanocrystalline diamond (NCD) films were deposited using a dc arc plasma jet CVD system on the seeded metallic layers and, for comparison, a seeded Si without any metallic layer. The effect of metallic seed layers on the nucleation, microstructure, composition and mechanical properties of NCD films was investigated by atomic force microscopy (AFM), scanning electron microscopy (SEM), X-ray diffraction (XRD), Raman spectroscopy and nanoindentation. We found that the metallic seed layers were transformed into metallic carbide or/and metallic silicide during the deposition of NCD films at high temperature. Adding metallic seed layers had no obvious effect on the bonding structure of the NCD films but significantly improved their surface roughness and mechanical properties. The NCD film deposited on W seed layer displays the lowest root-mean-square roughness of 19 nm while that on Ti seed layer has the highest compactness, hardness and elastic modulus.
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