Optimization of Test/Diagnosis/Rework Location(s) and Characteristics in Electronic System Assembly

In this paper, an optimization methodology is used to select the locations and characteristics of test, diagnosis and rework operations in electronic systems assembly processes. Real-coded genetic algorithms are used to perform a multi-variable optimization that minimizes the yielded cost of products resulting from an assembly process that includes test/diagnosis/rework operations characterized by costs, yields fault coverage, and rework attempts. A general complex process flow is analyzed using the algorithms proposed in this paper, and a multichip module assembly process flow is used to demonstrate that the methodology can identify optimum test and rework solutions that result in a reduction in yielded cost. Editor: H. G. Kerkhoff Zhen Shi is a Software Architect at Prequel Solutions Inc. Dr. Zhen Shi has a Ph.D. degree in Mechanical Engineering from the University of Maryland. He has several technical publications on Electronic Testing, Manufacturing Cost Optimization, and Computer-Aided Design. His current research interests include System Cost optimization, Software Testing and ERP. Peter Sandborn is an Associate Professor in Mechanical Engineering, Director of the Electronic Systems Cost Modeling Laboratory and a member of the CALCE Electronic Products and Systems Center (EPSC) at the University of Maryland. Prior to joining the University of Maryland, he was a founder and Chief Technical Officer of Savantage, Inc. Dr. Sandborn has a Ph.D. degree in electrical engineering from the University of Michigan and is the author of over 100 technical publications and several books on multichip module design and electronic parts. He is an Associate Editor for the IEEE Transactions on Electronics Packaging Manufacturing, and he is on the editorial board for the International Journal of Performability Engineering. His current research interests include technology tradeoff analysis for electronic packaging, parts selection and management for electronic systems including electronic part obsolescence forecasting and management, and system lifecycle and risk economics.