Comparative evaluation of thermal interface materials for improving the thermal contact between an operating computer microprocessor and its heat sink |
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Authors: | Timothy A Howe Chia-Ken Leong D D L Chung |
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Affiliation: | (1) Composite Materials Research Laboratory, University at Buffalo, State University of New York, 14260-4400 Buffalo, NY |
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Abstract: | Testing of the relative effectiveness of various thermal interface materials for improving the thermal contact between the
well-aligned mating surfaces of an operating computer microprocessor (with an integrated heat spreader) and its heat sink
shows that carbon black paste, whether by itself or as a coating on aluminum or flexible graphite, is more effective than
silver paste (Arctic Silver), but is comparable in effectiveness to aluminum paste (Shin-Etsu). The carbon black paste by
itself is as effective as the Shin-Etsu paste coated aluminum. The Shin-Etsu paste is more effective than Arctic Silver, whether
by itself or as a coating. The relative performance is mostly consistent with that assessed by measuring the thermal contact
conductance. The correlation is particularly strong for conductance below 3×104 W/m2·°C. The discrepancy is attributed to the difference in surface roughness between computer and guarded hot plate surfaces.
In the case in which the mating surfaces of microprocessor and heat sink are not well aligned, Shin-Etsu and Arctic Silver
are more effective than carbon black. |
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Keywords: | Thermal interface material thermal contact heat sink microprocessor computer thermal resistance |
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