| 高速MCM布线网互连和封装效应的计算机仿真 |
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| 引用本文： | 毛吉峰,李征帆,曹毅,徐勤卫.高速MCM布线网互连和封装效应的计算机仿真[J].电子学报,2000,28(5):130-132. |
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| 作者姓名： | 毛吉峰 李征帆 曹毅 徐勤卫 |
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| 作者单位： | 上海交通大学电子工程系,上海 200030 |
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| 摘 要： | 本文针对高速MCM布线网中由互连和封装引起的寄生效应提出了进行计算机仿真的方法.此方法以兰召斯Pade逼近算法(PVL)为基础,综合了部分元等效电路的三维模型,微分求积法的互连线宏模型,求解包含通孔、多导体互连线和集总元件组成的复杂线网对高速脉冲信号的响应.为分析高速MCM设计中的电特性问题提供了高效的工具.
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| 关 键 词： | 兰召斯Pade逼近 微分求积法 部分元等效电路 渐近波形估值 |
| 收稿时间： | 1998-09-11 |
Simulation of Interconnection and Package Effect in High-speed MCM |
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| MAO Ji-feng,LI Zheng-fai,CAO Yi,XU Qin-wei.Simulation of Interconnection and Package Effect in High-speed MCM[J].Acta Electronica Sinica,2000,28(5):130-132. |
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| Authors: | MAO Ji-feng LI Zheng-fai CAO Yi XU Qin-wei |
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| Affiliation: | Dept.E.E,Shanghai Jiaotong University,Shanghai 200030,China |
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| Abstract: | A method is proposed to evaluate the parasitic effect caused by interconnection and packaging in high speed MCM.Based on the PVL reduction algorithm,the method combines PEEC and DQ (differential quadrature) method to model 3D structure and interconnect,respectively.It can be applied to evaluate transient responses of complex circuits which are composed of via,interconnects and lumped components.As a result,it provides an efficient tool to analyze the performance in high speed MCM. |
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| Keywords: | PVL algorithm DQ mothod PEEC AWE |
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