| Abstract: | In this paper we present a comparison between two non-destructive techniques for crack detection in MLCCs. First, if a type II MLCC is biased with a DC field, the capacitor becomes temporarily ‘poled’ and can act as a transducer. This is induced by a residual piezoelectric effect used in the impedance spectroscopy method. Second, we used a scanning ultrasonic system working in the 10–100 MHz frequency bandwidth. To understand the ultrasonic signature, we used time-of-flight (TOF) detection with short-time Fourier transform (STFT) analysis to determine the depth and nature of defects with high accuracy. An application of digital signal processing to the characterization of defects is presented for a lot of MLCCs with cracks defects. For comparison, the same lot was tested with the piezoelectric method. The two techniques are closely correlated. © 1998 John Wiley & Sons, Ltd. |
