Effect of temperature on the strength and conductivity of a deformation processed Cu-20%Fe composite

The high temperature (22–600 °C) properties were evaluated for a Cu-20%Fe composite deformation processed from a powder metallurgy compact. The ultimate tensile strengths decreased with increasing temperature but were appreciably better than those of similarly processed Cu at temperatures up to 450 °C. At 600 °C, the strength of Cu-20%Fe was only slightly better than that of Cu as a result of the pronounced coarsening of the Fe filaments. However, at temperatures of 300 and 450 °C, the strength of Cu-20%Fe is about seven and six times greater, respectively, than that of Cu, as compared to about a two fold advantage at room temperature. Therefore, Cu-20%Fe composites made by deformation processing of powder metallurgy compacts have mechanical properties much superior to those of similarly processed Cu at room temperature and at temperatures up to 450 °C. The pronounced decrease in electrical conductivity of deformation processed Cu-20%Fe as compared to Cu is attributed to the appreciable dissolution of Fe into the Cu matrix which occurred during the fabrication of the starting compacts where temperatures up to 675 °C were used. While the powder metallurgy compacts used for the starting material for deformation processing in this study did not lead to a high conductivity composite, the powder metallurgy approach should still be a viable one if processing temperatures can be reduced further to prevent the dissolution of Fe into the Cu matrix.