| 制作圆片级封装凸焊点的垂直喷镀机研制 |
| |
| 引用本文： | 王水弟,胡涛,贾松良. 制作圆片级封装凸焊点的垂直喷镀机研制[J]. 电子工业专用设备, 2003, 32(1): 38-42 |
| |
| 作者姓名： | 王水弟 胡涛 贾松良 |
| |
| 作者单位： | 清华大学微电子学研究所,北京,100084 |
| |
| 摘 要： | 介绍了为满足微电子新颖封装——圆片级封装(WLP)在硅圆片上制作凸焊点的需要,根据有限元分析模拟优化,设计研制了FEP-1垂直喷镀机。该机可用于φ100-φ150mm(φ4-φ6英寸)圆片上电镀Au、PbSn、In等凸焊点。在150mm液晶显示驱动电路硅圆片上,用该电镀机电镀制作出了合格的高度为17μm、间距为20μm的金凸点。
|
| 关 键 词： | 圆片级封装 凸焊点 喷镀 电镀设备 |
| 文章编号： | 1004-4507(2003)01-0000-00 |
| 修稿时间： | 2003-01-16 |
The Research and Development of Vertical Fountain Plating for Making Bumps in Wafer Level Package |
| |
| WANG Shui-di,HU Tao JIA Song-Hang. The Research and Development of Vertical Fountain Plating for Making Bumps in Wafer Level Package[J]. Equipment for Electronic Products Marufacturing, 2003, 32(1): 38-42 |
| |
| Authors: | WANG Shui-di HU Tao JIA Song-Hang |
| |
| Abstract: | This paper introduces the design and usage of FEP - 1 vertical fountain plating, which is met to fabricate bumps on wafers in wafer level package. Computational simulation and optimization by finite - element analysis (FEA) were used in designing vertical fountain plating. It is suitable for φ4-φ6 inches wafers to deposit bumps of Au, PbSn or hi. It was successful at fabrication of Au bumps on 6 inches wafers for LCD driver circuit. The height of bumps , which are fabricated by this machine, are 17 μm and the space is 20 /μrn. |
| |
| Keywords: | Wafer Level Package (WLP) Bumps Vertical Fountain Plating Plating Machine |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
|
