埋入式电容印制电路板制作工艺

本篇论文主要采用FR406埋入电容材料结合现有的生产设备及条件参数进行工艺兼容性的研究。FR406材料相当于一张超薄的FR-4基材,因而采用标准薄板的图形转移工艺进行电容内层图形的制作。电容材料铜箔表面与半固化片层压的抗剥强度满足IPC接受标准,去钻污及电镀后孔壁质量也比较满意。小面积电容误差分布说明了工艺过程对容值的影响不是很大。因此,采用FR406BC材料进行埋入电容制作是可行的。

Productive Process of Embedded Capacitor for PCB

In this paper we briefly evaluated the processing compatibility of the FR406 BC materials with existing equipments and process parameters. Since the FR406BC material is just like a ultrathin FR-4 laminate, standard pattern transferring process and the parameters of ultrathin laminates can be used to fabricate the inner layer of the thin core capacitors. The peel strength of test specimens after lamination were all more than the values from IPC standard. The pictures of hole walls from SEM showed a perfect result after desmear and metallization. From a large number of capacitive values of 2mm2 rectangle capacitor patterns, we can draw a conclusion that processes do not have strong effects on capacitance. So manufacturing embedded capacitance is accessible by using FR406BC materials.