Creep behaviour of Si3N4/Y2O3/Al2O3/AIN alloys

The compression creep behaviour of pressureless sintered Y₂O₃/Al₂O₃/AIN-doped Si₃N₄ was studied between 1473 and 1673 K, under stresses ranging from 100–300 MPa. Strain rate versus stress and temperature analysis give a stress exponent n1 and an activation energy Q=860 kJ mol^–1. Microstructural change was investigated by transmission electron microscopy. The observed strain whorls, the stress exponent and the activation energy are indicative of a solution-diffusion-precipitation accommodated grain-boundary sliding where the diffusion through the glass is rate controlling.