| 铜应力缓解层对陶瓷-金属连接残余应力的影响 |
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| 引用本文： | 张小勇,楚建新,叶军,陆艳杰,刘鑫. 铜应力缓解层对陶瓷-金属连接残余应力的影响[J]. 真空电子技术, 2006, 0(4): 31-33 |
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| 作者姓名： | 张小勇 楚建新 叶军 陆艳杰 刘鑫 |
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| 作者单位： | 北京有色金属研究总院,北京,100088 |
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| 摘 要： | 用有限元法计算了不同厚度铜片对Si3N4-4Cr10Si2Mo连接四点弯曲试样残余应力的影响，找出最大残余应力位置及数值。测量了不同厚度铜片作缓解层时连接试样强度。计算结果与测量结果一致性较好。当铜片厚度为0．3mm时，连接试样残余应力最小，连接强度最高。
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| 关 键 词： | 陶瓷-金属连接 应力 缓解层 有限元法 |
| 文章编号： | 1002-8935(2006)04-0031-03 |
| 收稿时间： | 2006-08-15 |
| 修稿时间： | 2006-08-15 |
The Influence of Cu Buffer Layer on the Residual Stress of a Ceramic-Metal Joint |
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| ZHANG Xiao-yong,CHU Jian-xin,YE Jun,LU Yan-jie,LIU Xin. The Influence of Cu Buffer Layer on the Residual Stress of a Ceramic-Metal Joint[J]. Vacuum Electronics, 2006, 0(4): 31-33 |
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| Authors: | ZHANG Xiao-yong CHU Jian-xin YE Jun LU Yan-jie LIU Xin |
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| Affiliation: | Beijing General Research Institute for Nonferrous Metals, Beijing 100088, China |
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| Abstract: | The influence of various copper foil thickness on the residual stress of the Si3N4-4Cr10Si2Mo joint was calculated by using finite element method. The position and value of the maximum residual stress were obtained. The joint strengths for different copper buffer layers were experimentally measured. The calculated and measured results are in good agreement. When the copper foil is 0.3 mm thick, the residual stress of joints reaches the minimum, resulting in the maximum joint strength. |
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| Keywords: | Ceramic-metal joint Stress Buffer Finite element method |
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