| Abstract: | A novel electrodeposition technique is developed to estimate time‐averaged convective local mass transfer coefficients. This method is based on the diffusion‐controlled deposition rate of copper. With an electrolyte solution consisting of H2SO4 and CuSO4, copper is dissolved at the anode and deposited onto the nickel cathode. The thickness of the copper, measured with an optical microscope, provides an estimate of the time‐averaged local mass transfer coefficient for the given location, and by depositing multiple layers, the coefficients under different flow conditions can be obtained from one cathode. The results for laminar flow in a smooth, round pipe showed good agreement with those calculated from the analytical Leveque solution. Results were also obtained for turbulent flow and demonstrate the potential for acquiring convective local mass transfer coefficients for various flow configurations. |
