| 加面层压垫板生产中的起泡问题浅谈 |
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| 引用本文： | 阙宏雨,罗小阳.加面层压垫板生产中的起泡问题浅谈[J].印制电路信息,2010(4):25-27,36. |
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| 作者姓名： | 阙宏雨 罗小阳 |
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| 作者单位： | 湖南卓扬电路板材料有限公司,湖南醴陵,412200 |
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| 摘 要： | 目前PCB行业对于垫板的质量要求非常高，这就要求垫板的各方面性能都要非常好，包括垫板的厚度、硬度及表面状况等等。文章针对加面层压垫板在生产过程中引起起泡的基本因素和引起起泡的机理做了一个较全面的介绍，利于生产企业有针对性的采取有效措施解决问题。
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| 关 键 词： | 垫板 起泡 挥发物 |
Discussion about the Bubble Issue When Producing Covered Layer-up Backup Board |
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| QUE Hong-yu LUO Xiao-yang.Discussion about the Bubble Issue When Producing Covered Layer-up Backup Board[J].Printed Circuit Information,2010(4):25-27,36. |
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| Authors: | QUE Hong-yu LUO Xiao-yang |
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| Affiliation: | QUE Hong-yu LUO Xiao-yang |
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| Abstract: | As the high-quality requirement of backup board used in PCB industry,higher requirements including thickness,hardness and surface conditions etc.for backup board are needed in synchrony.In this paper,we focus on bubble theory and reasons,which helps backup board manufacturer make proper methods to solve these problems. |
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| Keywords: | backup board bubble volatile compounds |
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