| 化学镀铜法包覆铝及氧化铜团聚粉体工艺研究 |
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| 引用本文： | 闫军,崔海萍,杜心康,王建江. 化学镀铜法包覆铝及氧化铜团聚粉体工艺研究[J]. 电镀与精饰, 2005, 27(2): 24-27 |
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| 作者姓名： | 闫军 崔海萍 杜心康 王建江 |
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| 作者单位： | 军械工程学院,理化教研室,河北,石家庄,050003;军械工程学院,先进材料研究所,河北,石家庄,050003 |
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| 摘 要： | 研究了以次磷酸钠为还原剂，在Al及CuO团聚粉体上直接化学镀铜的工艺，利用正交试验设计优化了工艺配方。对优化的配方进行验证实验，用扫描电镜和能谱分析了镀覆效果。结果表明该工艺配方简便易行，具有良好的镀覆能力，与传统工艺相比具有镀液稳定性好，工作温度低，同时不破坏粉体的优点。
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| 关 键 词： | 团聚粉 化学镀 Cu包覆 |
| 文章编号： | 1001-3849(2005)02-0024-04 |
| 修稿时间： | 2004-05-24 |
Technology for Cu Coating Agglomerated Powders of Al-CuO by Chemical Plating |
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| YAN Jun,CUI Hai-ping,DU Xin-kang,WANG Jian-jiang. Technology for Cu Coating Agglomerated Powders of Al-CuO by Chemical Plating[J]. Plating & Finishing, 2005, 27(2): 24-27 |
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| Authors: | YAN Jun CUI Hai-ping DU Xin-kang WANG Jian-jiang |
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| Abstract: | Technology of copper chemical plating with sodium hypophosphite as reducing agent on agglomerated powders of Al-CuO was studied. Orthogonal design was employed to optimize the technological formulation and the formulation was tested and verified through experiments. The coating effect was analyzed by SEM and XRD. The results show that the technology is simple and easy to operate, and has excellent coating ability. The technology has advantages of good bath stability, low working temperature and less damage to the agglomerated powders as compared to the traditional technology. |
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| Keywords: | agglomerated powder chemical plating copper coated |
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