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咪唑化合物在铜表面的成膜机理
引用本文:赵永生,庞正智,卢艳华. 咪唑化合物在铜表面的成膜机理[J]. 化工学报, 2004, 55(4): 659-663
作者姓名:赵永生  庞正智  卢艳华
作者单位:北京化工大学材料科学与工程学院,北京,100029;北京化工大学材料科学与工程学院,北京,100029;北京化工大学材料科学与工程学院,北京,100029
基金项目:教育部重点军工新材料科研项目 (No DZ -2 0 0 2 -0 0 5 )
摘    要:咪唑化合物是近年来研究较多的一类杂环化合物,在生物工程、医药、高性能复合材料等领域显示了重要的学术价值和突出的应用前景.尤其咪唑化合物与金属铜具有很好的配位反应活性,能瞬间吸附在铜表面,生成致密的防氧化、抗腐蚀薄膜(0.20~0.40μm),成为一类优良的金属表面处理剂,是制造高精密微型计算机的优良化学材料,但是有关咪唑化合物在金属表面成膜过程与机理方面的研究还不多见.

关 键 词:咪唑    表面处理  成膜
文章编号:0438-1157(2004)04-0659-05
收稿时间:2003-05-26
修稿时间:2003-8-21 

MECHANISM OF FILM FORMING FOR IMIDAZOLE AND ITS DERIVATIVES ON SURFACE OF COPPER
ZHAO Yongsheng,PANG Zhengzhi,LU Yanhua. MECHANISM OF FILM FORMING FOR IMIDAZOLE AND ITS DERIVATIVES ON SURFACE OF COPPER[J]. Journal of Chemical Industry and Engineering(China), 2004, 55(4): 659-663
Authors:ZHAO Yongsheng  PANG Zhengzhi  LU Yanhua
Abstract:The UV absorbances of Cu (Ⅱ) analog complexes prepared with imidazole and several derivatives were determined, on the basis of which the structures of the analog complexes and the coordination agent-coordination center ratios of the complexes were obtained. The structures of the films formed by imidazole compounds on the surface of copper were determined by using XPS.The mechanism of film forming for imidazole and its derivatives on the surface of copper was developed by means of comparing the structures of the films and those of the analog complexes.
Keywords:imidazole  copper  surface treating  film forming
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