Enhanced adhesion of PMMA to copper with black oxide for electrodeposition of high aspect ratio nickel-iron microstructures |
| |
Authors: | V. K. P. Kanigicherla K. W. Kelly E. Ma W. Wang M. C. Murphy |
| |
Affiliation: | (1) Department of Mechanical Engineering Microsystem Engineering Team (μSET) Louisiana State University Baton Rouge, LA 70803, USA, US |
| |
Abstract: | Copper is widely used as a plating base for soft magnetic alloy electrodeposition in sensors and actuators. PMMA, the X-ray resist used in the LIGA process, typically has poor adhesion with copper. The use of black oxide of copper to enhance PMMA-copper adhesion was investigated. In this work, peel strength as a function of treatment time and the method of bonding was evaluated using an ASTM standard T-peel test. Peel strength increased with increasing treatment time. The feasibility of producing microstructures with predictable 3-D geometry for use in resonating sensors was investigated using the process developed. Nickel-iron structures of 100-1000 micrometers wide and 500 micrometers tall were successfully electrodeposited. Growth of other representative microstructures is being investigated. Received: 25 August 1997/Accepted: 3 September 1977 |
| |
Keywords: | |
本文献已被 SpringerLink 等数据库收录! |