| 电子组装中焊点的失效分析 |
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| 引用本文： | 宁叶香,潘开林,李逆.电子组装中焊点的失效分析[J].电子工业专用设备,2007,36(9):46-50,73. |
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| 作者姓名： | 宁叶香 潘开林 李逆 |
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| 作者单位： | 桂林电子科技在大兴安岭机电工程学院,广西,桂林,541004 |
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| 摘 要： | 焊点的失效分析是电子产品质量和可靠性保证体系的重要组成部分。本文首先概述了焊点的失效机理,主要包括热致失效、机械失效、电化学失效。在此基础之上,综述了焊点失效分析的基本流程与各类失效分析方法,并对无铅条件下该领域的研究作了简要评述。
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| 关 键 词： | 电子组装 失效分析 焊点 失效机理 |
| 文章编号： | 1004-4507（2007）09-0046-05 |
| 修稿时间： | 2007-08-22 |
Failure Analysis of Solder Joints in Electronic Assemblies |
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| NING Ye-xiang,PAN Kai-lin,LI Ni.Failure Analysis of Solder Joints in Electronic Assemblies[J].Equipment for Electronic Products Marufacturing,2007,36(9):46-50,73. |
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| Authors: | NING Ye-xiang PAN Kai-lin LI Ni |
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| Abstract: | Failure analysis of solder joints plays an important role in electronic products quality and re- liability assurance system. Firstly, main failure analysis mechanisms are summarized, including thermally induced failures, mechanically induced failures, and electrochemical induced failures. Furthermore, failure analysis basic flow, methods are generalized, and the research prospect and challenges of failure analysis in the future are reviewed in this paper. |
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| Keywords: | Electronic assembly Failure analysis Solder joints Failure mechanism |
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