大功率 LED 汽车前照灯散热系统设计

针对大功率发光二极管(Light-emitting diode, LED)对结点温度要求严格控制的特点，提出一种基于导热板+热沉的散热技术来满足LED 前照灯散热封装的需求。通过数值模拟和试验方法研究了芯片的结温随环境温度、导热板长度、散热器倾斜角度、芯片封装深度的变化规律，试验值与数值模拟值基本吻合。结果均表明，环境温度及散热器的倾斜角对芯片结温有较大影响，芯片结温随环境温度基本呈线性变化关系，散热装置水平放置的散热效果最高。

Thermal model design and analysis of high-power LED Automotive headlamp cooling device

In view of the characteristics of high power light-emitting diode (LED), such as strict junction temperature (Tj) control, a heat conductive plates (HCPS) coupled with heat sink system is presented for thermal management of LED headlight. In addition, considerable experiments and simulations were conducted on nature convection heat transfer from HCPS with heat sink subject to the influence of ambient temperature, the length of HCPS, the inclination angles of cooler, the package depth of chips, respectively. The numerical results were validated with the experimental results and they were in good agreement. Results indicate that the Tj changes linear basically with the increase in ambient temperature, and the sideward facing orientation of cooler yielded the best cooling performance. temperature, the length of HCPS, the inclination angles of cooler, the package depth of chips, respectively. The numerical results were validated with the experimental results and they were in good agreement. Results indicate that the T j changes linear basically with the increase in ambient temperature, and the sideward facing orientation of cooler yielded the best cooling performance.