Preparation and analysis of a flexible curing agent for epoxy resin |
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| Authors: | Y Yang Gong Chen K M Liew |
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| Affiliation: | 1. Department of Building and Construction, City University of Hong Kong, Kowloon, Hong Kong;2. Department of Engineering Mechanics, Kunming University of Science and Technology, Kunming, Yunnan, People's Republic of China;3. School of Material Science and Engineering, Beijing University of Aeronautics and Astronautics, Beijing, People's Republic of China |
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| Abstract: | A kind of novel aromatic amine bis(4‐nonyl‐2,5‐diamine‐penoxyl)alkylate (RAn) as curing agents for epoxy resins were prepared through three steps of reactions using nonyl phenol and dibromoalkylate as materials. Dynamic mechanical analysis (DMA) indicated that the secondary relaxation for the resins cured by RAn were generated by the nonyls in RAn molecules when temperature was below ?50°C. Comparing with other reference resins, the enhancement for toughness of RAn cured‐resins were at least 15%, which were contributed by such secondary relaxation. Furthermore, stiffness of the networks and thermal properties of the resins were not influent by the flexible groups (nonyl) in RAn after curing, since the groups were located only in the branched chains of the networks. The mechanical and thermal properties of the new material have been significantly enhanced. The relevant method and procedure developed through this research have been granted Chinese patent recently (Yang and Gong, Chin. Pat. CN1978483A, 2007). © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009 |
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| Keywords: | curing agent flexibilizer epoxy resin secondary relaxation |
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