首页 | 本学科首页   官方微博 | 高级检索  
     


Molecular encapsulation of linoleic and linolenic acids by amylose using hydrothermal and high-pressure treatments
Affiliation:1. UR1268 Biopolymères, Interactions, Assemblages, INRA, F-44300 Nantes, France;2. Oniris, UMR CNRS 6144 GEPEA, BP 82225, 44322 Nantes Cedex 3, France;3. CNRS, F-44307 Nantes, France;1. Departamento de Tecnologia e Ciência dos Alimentos, Centro de Ciências Rurais, Universidade Federal de Santa Maria–UFSM, Santa Maria, RS, CEP 97105-900, Brazil;2. Department of Biotechnology, Technical University of Denmark, Building 221, Lyngby DK-2800, Denmark;1. College of Food Science, Fujian Agriculture and Forestry University, Fuzhou, Fujian, PR China;2. Fujian Provincial Key Laboratory of Quality Science and Processing Technology in Special Starch, Fuzhou, Fujian, PR China;3. China-Ireland International Cooperation Centre for Food Material Science and Structure Design, Fujian Agriculture and Forestry University, Fuzhou, PR China
Abstract:The health benefits of polyunsaturated fatty acids are well known, however their fragility is a drawback as it leads to their degradation. The objective of this study was to develop innovative assemblies, using the capacity of starch to encapsulate small molecules, for the protection of polyunsaturated fatty acids like linoleic acid and linolenic acid. These assemblies were produced by hydrothermal treatment, and by high-pressure treatment (20 min at 500 MPa at a temperature of 40 °C). They were then analyzed and characterized by X-ray diffraction (XRD), differential scanning calorimetry (DSC), nuclear magnetic resonance (13C CP/MAS NMR) and a heating cell in XRD. The results showed that amylose–ligand complexes were formed during both treatments and two crystalline types V6I and V6II were obtained. The techniques used show excellent complementarities in the determination of important structural features such as crystalline type, helical conformation and nature of the inclusion.
Keywords:
本文献已被 ScienceDirect 等数据库收录!
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号