Interface profile optimization for planar stress wave attenuation in bi-layered plates |
| |
| Affiliation: | 1. Department of Civil, Structural, and Environmental Engineering, University at Buffalo, State University of New York, Buffalo, NY 14260, USA;2. Material Science and Technology Division, Physical Sciences Directorate, Oak Ridge National Lab, Oak Ridge, TN 37831, USA;3. Department of Mechanical and Aerospace Engineering, University at Buffalo, State University of New York, Buffalo, NY 14260, USA;1. State Key Laboratory of Hollow Fiber Membrane Materials and Processes (Tianjin Polytechnic University), Tianjin 300187, PR China;2. Department of Environmental and Chemical Engineering, Tangshan College, Tangshan 063000, PR China;1. Key Laboratory of Green Chemistry and Technology of Ministry of Education, College of Chemistry, Sichuan University, Chengdu 610064, PR China;2. Key Laboratory of Luminescence and Optical Information of Ministry of Education, Institute of Optoelectronics Technology, Beijing Jiaotong University, Beijing 100044, PR China;1. National Institutes for Quantum and radiological Science and technology, Naka, Ibaraki 311-0193, Japan;2. Japan Atomic Energy Agency, Tokai, Ibaraki 311-1195, Japan;3. Japan Atomic Energy Agency, Tsuruga, Fukui 919-1279, Japan;1. Department of Science Education, Jeonju University, Jeonju 560-759, Republic of Korea;2. Department of Carbon Fusion Engineering, Jeonju University, Jeonju 560-759, Republic of Korea |
| |
| Abstract: | Stress waves scatter upon entering a new medium. This occurs due to the reflection and transmission of the waves, which depends on the impedance mismatch between the two materials and the angle of incidence. For a bi-layered structure with finite dimensions and constant impedance ratio, the scattering and intensity of the stress waves may be varied by changing the interface profile between the two layers. In this paper, a methodology is proposed for optimizing the interface profile between the layers of a finite bi-layered plate for the objective of planar stress wave attenuation. The bi-layered plates are subjected at one end to highly impulsive loadings with various durations, and the geometry of the internal interface is optimized for the purpose of minimizing the amplitude of the maximum reaction force at the opposite fixed end. The optimization methodology is based on a genetic algorithm, which is coupled with a finite element method for analyzing the wave propagation behavior of the plates. It is observed that the interface profile and the amount of stress wave attenuation depend on the duration of the applied impulsive loading, with higher amounts of attenuation obtained when the wavelength associated with the impulsive load is small compared to the dimensions of the bi-layered plates. |
| |
| Keywords: | A. Plates B. Impact behavior B. Interface C. Finite element analysis (FEA) Stress wave propagation |
| 本文献已被 ScienceDirect 等数据库收录！ |
|
