| 基于Moldflow/MPI的UPS电源壳体注塑成型分析 |
| |
| 引用本文： | 段贤勇,何顺荣. 基于Moldflow/MPI的UPS电源壳体注塑成型分析[J]. 塑料科技, 2011, 39(3) |
| |
| 作者姓名： | 段贤勇 何顺荣 |
| |
| 作者单位： | 1. 合肥工业大学材料与工程学院,安徽,合肥,230009;安徽机电职业技术学院,安徽,芜湖,241000
2. 合肥工业大学材料与工程学院,安徽,合肥,230009 |
| |
| 摘 要： | 运用Moldflow/MPI模块对UPS电源壳体注塑成型过程进行了数值模拟分析,预测了熔体充模过程中的型腔压力分布、温度分布、锁模力大小、体积收缩率及翘曲变形;根据分析结果,提出了工艺优化方案,从而缩短模具设计制造周期。
|
| 关 键 词： | Moldflow/MPI 注塑成型 数值模拟 |
Injection Molding Process Analysis of UPS Box Based on Moldflow/MPI |
| |
| Duan Xianyong,He Shunrong. Injection Molding Process Analysis of UPS Box Based on Moldflow/MPI[J]. Plastics Science and Technology, 2011, 39(3) |
| |
| Authors: | Duan Xianyong He Shunrong |
| |
| Affiliation: | Duan Xianyong1,2,He Shunrong1 1 School of Material Sciences and Engineering,Hefei University of Technology,Hefei 230009,China 2 Anhui Vocational College of Machinery and Electricity Technology,Wuhu 241000,China |
| |
| Abstract: | The injection molding process of UPS box was simulated by use of Moldflow/MPI.The pressure distribution,temperature distribution,clamp force,shrinkage and warpage of cavity during filling model were predicted,and then the process optimization scheme was given to shorten design and manufacture period of injection mould according to the analysis results. |
| |
| Keywords: | Moldflow/MPI Injection molding Numerical simulation |
| 本文献已被 CNKI 万方数据 等数据库收录！ |
|
