确保SOD系列产品在编带中无侧翻的方法

随着微电子技术的飞速发展,芯片特征尺寸的缩小,对微电子封装技术的要求也越来越高,同样对产品测试打印编带的要求也越来越高。而SOD系列小器件产品在编带中一直存在侧翻的问题,经常会引起客户的投诉。文章针对产品编带中存在的侧翻现象,在印章检的基础上再加上对管脚侧翻检的功能,从而能有效确保编带产品无侧翻现象,提高产品的编带质量,降低客户的投诉,大大减少外观检的工作量,减少因编带产品有严重侧翻带来的返工量。

How to Prevent the Side Set or Turn over in Taping of SOD Series Products

Along with the development of the technology of microelectronics,the size of the wafer is getting much smaller than before,and the requirement for the technology of microelectronics encapsulation is getting even higher as well.Meanwhile,the quality of the test,marking,tape & reel of the encapsulation products requires much higher precision.The side set or turn over in taping of SOD series products generally exists while producing,and this serious issue causes the a large number of customer complains.The tex...