| 无氧铜密封件漏气原因的金相显微分析 |
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| 引用本文： | 丁丽,章安辉,李宝珠,周智惠,刘立娜.无氧铜密封件漏气原因的金相显微分析[J].现代仪器,2010(6). |
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| 作者姓名： | 丁丽 章安辉 李宝珠 周智惠 刘立娜 |
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| 摘 要： | 用于电真空器件密封用的无氧铜在使用中漏气,利用金相显微技术对不同氧含量的无氧铜进行对比分析,发现:无氧铜中氧含量偏高,出现"氢病",造成微裂纹,导致无氧铜在使用过程中出现漏气。
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| 关 键 词： | 无氧铜 微裂纹 氢病 |
Gas leakage causes analysis of oxygen-free copper seal devices by metallographic microscopy |
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| Ding Li,Zhang Anhui,Li Baozhu,Zou Zhihui,Li Lina.Gas leakage causes analysis of oxygen-free copper seal devices by metallographic microscopy[J].Modern Instruments,2010(6). |
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| Authors: | Ding Li Zhang Anhui Li Baozhu Zou Zhihui Li Lina |
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| Abstract: | Oxygen-free copper was always used to keep electron tube sealing,but gas leakage happened sometimes. Oxygen-free coppers with different oxygen content were comparative analysis by metallographic microscopy. And come to a conclusion: oxygen-free copper with high oxygen content lead to microcrack,then gas leakage will happen.This is called inverse hydrogen embrittlement. |
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| Keywords: | Oxygen-free copper Microcrack Inverse hydrogen embrittlement |
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