电沉积条件对Fe-Ni-P合金沉积的影响

为促进Fe-Ni-P合金电沉积层在信息存储材料和屏蔽材料中的应用,研究了pH值、电流密度等工艺条件对合金沉积速度、组成、表面形貌和结构的影响.结果表明:当镀液主盐物质的量比Fe/Ni=5/5时,随pH值从2.0增加到4.0,镀层中Fe原子分数从6.92%增加到64.47%,Ni从61.03%下降到8.07%,P从32.05%下降到27.46%;随电流密度从20 mA/cm2增加到50 mA/cm2,镀层中Fe原子分数从2.49%增加到63.15%,Ni从55.99%下降到13.50%,P从41.52%下降到23.35%.用X射线衍射和扫描电镜研究了镀层的结构和表面形貌,试验表明,所有镀层均呈非晶态结构,受工艺条件影响较小;随pH值从2.0增加到4.0,镀层表面的圆形颗粒粒径逐渐增大.

Effect of Electrodeposition Conditions on the Deposition and Properties of Fe-Ni-P Alloy Coating

The effects of electrodepositing conditions such as the pH value of the bath and current density on the plating rate and composition, structure, and morphology of the electroplated Fe-Ni-P Alloy coating were investigated. The structure and morphology of the Fe-Ni-P coating were studied by means of X-ray diffraction and scanning electron microscopy. It was found that the plating rate was greatly dependent on the plating conditions. Namely, as the mole ratio of Fe/Ni in the plating bath was fixed at 5/5, the atomic fraction of Fe in the alloy coating increased from 6.92% to 64.47% with the increase of the bath pH value from 2.0 to 4.0, while the content (atomic fraction) of Ni in the alloy coating decreased from 61.03% to 8.07% and that of P decreased from 32.05% to 27.46% therewith. Similarly, the atomic fraction of Fe in the alloy coating increased from 2.49% to 63.15% with the increase of the current density from 20 mA/cm 2 to 50 mA/cm 2, while the content of Ni decreased from 55.99% to 13.50% and that of P decreased from 41.52% to 23.35% therewith. Moreover, the electrodepositing conditions had little effect on the structure of the alloy coating and thereby the coatings deposited at different conditions had amorphous structure. Besides, the grit size of the circular particulates on the surface of the as-deposited alloy coating increased with increasing pH value from 2.0 to 4.0.