A quantitative evaluation of time-independent and time-dependent deformations of lead-free and lead-containing solder alloys |
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| Authors: | Ken-Ichi Ohguchi Katsuhiko Sasaki Masahiro Ishibashi |
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| Affiliation: | (1) Department of Materials Science and Engineering, Akita University, 010-8502 Akita, Japan;(2) Division of Mechanical Science, Hokkaido University, 060-8628 Sapporo, Japan;(3) NEC 34, 305-8501 Ibaraki, Japan |
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| Abstract: | A method to separate plasticity and creep is discussed for a quantitative evaluation of the plastic, transient creep, and steady-state creep deformations of solder alloys. The method of separation employs an elasto-plastic-creep constitutive model comprised of the sum of the plastic, transient creep, and steady-state creep deformations. The plastic deformation is expressed by the Ramberg-Osgood law, the steady-state creep deformation by Garofalo’s creep law, and the transient creep deformation by a model proposed here. A method to estimate the material constants in the elasto-plastic-creep constitutive model is also proposed. The method of separation of the various deformations is applied to the deformation of the lead-free solder alloy Sn/3Ag/0.5Cu and the lead-containing solder alloy Sn/37Pb to compare the differences in the plastic, transient creep, and steady-state creep deformations. The method of separation provides a powerful tool to select the optimum lead-free solder alloys for solder joints of electronic devices. |
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| Keywords: | Lead-free solder alloy lead-containing solder alloy elasto-plastic-creep constitutive model time-independent deformation time-dependent deformation creep strain rate effect stress relaxation |
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