自切深进给电泳磨削技术

利用超细磨粒的电泳效应实现一种磨削技术称之为电泳磨削，通过超细磨粒电泳吸附层的研究，提出了自切深进给电泳磨削新工艺，即在机床无切深进给的条件下利用吸附在磨具上的磨粒层本身厚度的增加来实现微量进给。理论分析和试验研究表明，在普通磨床上应用不仅可以有效地降低工件表面粗糙度，同时还可以实现μm级的磨削深度。

A SELF-FEEDING ELECTROPHORESIS GRINDING PROCESS

A new grinding process using an abrasive layer which is formed by electrophoretic deposition in process as a cutting tool is called electrophoresis grinding. By the studying of the features and the forming mechanism of the ultra fine abrasive layer, a self feeding electrophoresis grinding process is introduced, in which the depth feeding is realized by growing of the abrasive layer without the machine feeding in depth. Both theoretic analysis and experiment studying show that not only the roughness on the worked surface are significantly improved but also the cutting depth can be controlled in submicron by this method.